Circuits and techniques to compensate memory access signals for variations of parameters in multiple layers of memory

ABSTRACT

Embodiments of the invention relate generally to semiconductors and memory technology, and more particularly, to systems, integrated circuits, and methods to implement circuits configured to compensate for parameter variations in layers of memory by adjusting access signals during memory operations. In some embodiments, memory cells are based on third dimensional memory technology. In at least some embodiments, an integrated circuit includes multiple layers of memory, a layer including sub-layers of semiconductor material. The integrated circuit also includes an access signal generator configured to generate an access signal to facilitate an access operation, and a characteristic adjuster configured to adjust the access signal for each layer in the multiple layers of memory.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of and claims priority to U.S. patentapplication Ser. No. 15/197,482, filed on Jun. 29, 2016, issued as U.S.Pat. No. 9,870,809, on Jan. 18, 2018, which is a continuation of andclaims priority to U.S. patent application Ser. No. 14/827,292, filedAug. 15, 2015, issued as U.S. Pat. No. 9,384,806, on Jul. 5, 2016, whichis a continuation of and claims priority to U.S. patent application Ser.No. 14/476,632, filed Sep. 3, 2014, issued as U.S. Pat. No. 9,129,668,on Sep. 8, 2015, which is a continuation of and claims priority to U.S.patent application Ser. No. 13/858,482, filed Apr. 8, 2013, issued asU.S. Pat. No. 8,854,881, on Oct. 7, 2014, which is a continuation of andclaims priority to U.S. patent application Ser. No. 12/931,438, filedFeb. 1, 2011, issued as U.S. Pat. No. 8,427,868, on Apr. 23, 2013, whichis a non-provisional of and claims priority to U.S. provisional patentapplication, 61/337,706, filed Feb. 3, 2010, and U.S. provisional patentapplication 61/337,299, filed Feb. 1, 2010, each of which isincorporated herein by reference in its entirety. This application isrelated to U.S. patent application Ser. No. 11/095,026, filed Mar. 30,2005, published as U.S. Pub. No. 2006/0171200, and entitled “MemoryUsing Mixed Valence Conductive Oxides,” which is incorporated herein byreference.

FIELD OF THE INVENTION

Embodiments of the invention relate generally to semiconductors andmemory technology, and more particularly, to systems, integratedcircuits, and methods to implement circuits configured to compensate forparameter variations in layers of memory by adjusting access signalsduring memory operations.

BACKGROUND

Variations in semiconductor wafer processing typically introduce defectsand unpredictable parametric variations (e.g., excessive current draw)into traditional memory technologies. Such variations generally affectthe reliability of memory devices. Some conventional memoryarchitectures include circuitry to improve reliability of memory devicesover fluctuations in process. In one approach, programmable circuitry isused to reduce the effects of process variations on memory operations inconventional memory technologies, which includes transistor orgated-based memories (e.g., DRAM, Flash, etc.). While such circuitry isfunctional, the conventional techniques of reducing the effects ofprocess variations are not well suited for advanced memory technologies.For example, in conventional memory architectures, the memory cells areformed in a single plane, which inherently provides for a uniformformation of semiconductor structures over a two-dimensional plane.Thus, the common techniques for improving program, read and eraseoperations in connection with conventional memory cells are notwell-suited for fine-tuning memory operations in other memorytechnologies.

It would be desirable to provide improved systems, integrated circuits,and methods that minimize one or more of the drawbacks associated withconventional memory architectures to compensate for parameter variationsassociated with the operation of memory cells, for example, in across-point memory array with multiple layers of memory.

BRIEF DESCRIPTION OF THE DRAWINGS

The various embodiments are more fully appreciated in connection withthe following detailed description taken in conjunction with theaccompanying drawings, in which:

FIG. 1 illustrates an example of an integrated circuit including memoryand a characteristic adjuster that facilitates generation oflayer-specific access signals, according to various embodiments;

FIG. 2 is a diagram illustrating a specific implementation of acharacteristic adjuster in accordance with various embodiments;

FIG. 3 depicts a cross-section view for an example of an integratedcircuit, according to one embodiment;

FIG. 4 is a flow diagram depicting an example of a process for adjustingaccess signals to access multiple layers of memory, according to someembodiments;

FIG. 5 is a functional block diagram depicting an example of acharacteristic adjuster configured to adjust access signals used toaccess multiple layers of memory, according to some embodiments; and

FIG. 6 depicts top plan views of a wafer processed FEOL to form aplurality of base layer die including active circuitry and the samewafer subsequently processed BEOL to form one or more layers of memorydirectly on top of the base layer die where the finished die cansubsequently be singulated, tested, and packaged into integratedcircuits.

Like reference numerals refer to corresponding parts throughout theseveral views of the drawings. Note that most of the reference numeralsinclude one or two left-most digits that generally identify the figurethat first introduces that reference number. Furthermore, the depictionsin the drawings are not necessarily to scale.

DETAILED DESCRIPTION

Various embodiments or examples of the invention may be implemented innumerous ways, including as a system, a process, an apparatus, or aseries of program instructions on a computer readable medium such as acomputer readable storage medium or a computer network where the programinstructions are sent over optical, electronic, or wirelesscommunication links. In general, operations of disclosed processes maybe performed in an arbitrary order, unless otherwise provided in theclaims.

A detailed description of one or more examples is provided below alongwith accompanying figures. The detailed description is provided inconnection with such examples, but is not limited to any particularexample. The scope is limited only by the claims, and numerousalternatives, modifications, and equivalents are encompassed. Numerousspecific details are set forth in the following description in order toprovide a thorough understanding. These details are provided as examplesand the described techniques may be practiced according to the claimswithout some or all of the accompanying details. For clarity, technicalmaterial that is known in the technical fields related to the exampleshas not been described in detail to avoid unnecessarily obscuring thedescription.

U.S. patent application Ser. No. 11/095,026, filed Mar. 30, 2005,published as U.S. Pub. No. 2006/0171200, and entitled “Memory UsingMixed Valence Conductive Oxides,” is hereby incorporated by reference inits entirety for all purposes and describes non-volatile thirddimensional memory elements that may be arranged in a two-terminalcross-point memory array. New non-flash re-writeable non-volatile memorystructures are possible with the capability of this third dimensionalmemory array. In at least some embodiments, a two-terminal memoryelement or memory cell can be configured to change conductivity whenexposed to an appropriate voltage drop across its two-terminals. Thememory element can include an electrolytic tunnel barrier in contactwith and electrically in series with a mixed valence conductive oxidethat includes mobile oxygen ions in some embodiments, as well asmultiple layers of mixed valence conductive oxide structures in otherembodiments. The electrolytic tunnel barrier comprises an electronicallyinsulating material that is thin enough to promote electron tunnelingduring data operations on the memory element (e.g., read and writeoperations) while also promoting a high electric field during writeoperations operable to cause the mobile oxygen ions to be transportedinto or out of the electrolytic tunnel barrier depending on thedirection of the electric field within the memory element. The directionof the electric field is determined by the polarity of the writevoltage. Therefore, the electrolytic tunnel barrier is permeable to themobile oxygen ions and is operative as an electrolyte to the mobileoxygen ions. The mobile oxygen ions are transported between theelectrolytic tunnel barrier and the mixed valence conductive oxide inresponse to an electric field generated by the application of the writevoltage across the electrolytic tunnel barrier and the mixed valenceconductive oxide. Examples of conductive metal oxides suitable for useas the mixed valence conductive oxide includes but is not limited toperovskites and binary oxides (e.g., a conductive binary oxide).Application of a write voltage across the memory element is operative tocreate a voltage drop across the electrolytic tunnel barrier thatgenerates a higher electric field within the electrolytic tunnel barrierthat is operative to transport a portion of the mobile oxygen ions inthe mixed valence conductive oxide into the electrolytic tunnel barrierfor a first polarity of the write voltage and to transport the portionof portion of the mobile oxygen ions in the electrolytic tunnel barrierback into the mixed valence conductive oxide for a second polarity ofthe write voltage, the second polarity is opposite the first polarity.

In some embodiments, an electrolytic tunnel barrier and one or moremixed valence conductive oxide structures do not need to operate in asilicon substrate (e.g., a silicon die or silicon wafer), and,therefore, can be fabricated back-end-of-the-line (BEOL) directly abovecircuitry fabricated front-end-of-the-line (FEOL) on the semiconductorsubstrate and being used for other purposes. Further, a two-terminalmemory element can be configured in a cross-point such that one terminalof the memory element is electrically coupled with an X-direction line(or an “X-line”) and the other terminal of the memory element iselectrically coupled with a Y-direction line (or a “Y-line”). A discretetwo-terminal memory element is one in which the two terminals of thememory element are directly electrically coupled with the conductivearray lines (e.g., X-line and Y-line or a Word-line and Bit-line) at itsrespective cross-point without any intervening structure such as aselection device, also known as a non-ohmic device (NOD). Therefore, adiscrete two-terminal memory element is one that is directlyelectrically in series with its respective conductive array lines.Examples of a selection devices/NOD include metal-insulator-metal (MIM)devices or one or more diodes that comprise an intervening structurethat is electrically in series with the memory element and with theconductive array lines. Unless otherwise specified herein, allreferences to a memory element or memory cell is a reference to adiscrete memory element or discrete memory cell that does not include aselection device or NOD. A third dimensional memory can include multiplememory layers that are vertically stacked upon one another, with memoryelements in a memory layer that sometimes share X-direction andY-direction lines with memory elements in adjacent memory layers. Inother embodiments, the memory elements in each memory layer haveelectrically isolated conductive array lines and do not share conductivearray lines with memory elements in adjacent memory layers. When a firstwrite voltage, VW1, is applied across the memory element (e.g., byapplying ½ VW1 to the X-direction line and ½ −VW1 to the Y-directionline), the memory element can switch to a low resistive state. When asecond write voltage, VW2, is applied across the memory element (e.g.,by applying ½ VW2 to the X-direction line and ½ −VW2 to the Y-directionline), the memory element can switch to a high resistive state. Memoryelements using electrolytic tunnel barriers and mixed valence conductiveoxides can have VW1 opposite in polarity from VW2.

FIG. 1 depicts an example of an integrated circuit including memory anda characteristic adjuster that facilitates generation of layer-specificaccess signals, according to various embodiments. In this example,integrated circuit 100 includes a memory 112 (e.g., memory formedback-end-of-the-line BEOL) a logic layer 130 formed (e.g., circuitryfabricated front-end-of-the-line FEOL) on a substrate 135 (e.g., asilicon (Si) wafer or die), an access signal generator 120, and acharacteristic adaption circuit 140. Memory 112 includes one or morelayers of memory or memory layers 114 a to 114 f that are formed (e.g.,BEOL) above some or all of logic layer 130 (e.g., FEOL CMOS circuitry).In an embodiment, memory 112 may comprise a non-flash rewriteablenon-volatile memory. Although memory layers 114 a-114 f are depicted asbeing separate from one another for purposes of explanation, memorylayers 114 a-114 f are in contact with one another and are verticallystacked above and in contact with the logic layer 130 (e.g., bottommostmemory layer 114 f is in contact with upper surface 135 of logic layer130) to form a unitary whole (e.g., a single die) for an integratedcircuit as depicted for integrated circuit 100′ as will be described ingreater detail below in regards to FIGS. 3 and 6.

A FEOL interlayer interconnect structure (see 255 in FIG. 2) includingvias, plugs, contacts, or similar electrically conductive structures(not shown) can be fabricated on top of the active circuitry in logiclayer 130 to serve as a foundation upon which the first 114 f andsubsequent memory layers 114 e-114 a can be grown along the +Z axis aspart of a BEOL non-volatile memory fabrication process. The interlayerinterconnect structure is operative to electrically couple theconductive array lines of the non-volatile cross-point memory arrays ineach memory layer with the corresponding active circuitry in the logiclayer 130. An upper surface 135 s of the interlayer interconnectstructure can be considered the 0-point on the Z-axis where FEOLprocessing ends and BEOL memory layer fabrication begins.

Access signal generator 120 is configured to generate layer-specificsignals 118 during an access operation (e.g., a read operation, aprogramming operation, or an erase operation) to transmit, for example,layer-specific programming voltage values, erase voltage values, readvoltage values, read current values, etc., to one layer in layers 114 ato 114 f. Access signal generator 120 is shown to include a read circuit122 configured to generate one or more read signals as an access signalduring read operations, a programming circuit 124 configured to generateone or more programming signals as an access signal, and an erasecircuit 126 configured to generate one or more erase signals as anaccess signal. Program and erase operations are generally referred to aswrite operations and read and write operations are types of dataoperations that can be performed on the one or more memory layers 114 ato 114 f in memory 112.

In some embodiments, access signal generator 120 and its constituentsare configured to generate layer-specific signals 118 having signalcharacteristics fine-tuned to the layer being accessed. For example, anaccess signal (i.e., a read signal) during a read operation can have asignal characteristic that is a magnitude characteristic, such as a readvoltage level (e.g., 1.0 volts), targeted for a certain layer 114 ofmemory. As another example, a read signal also can have another signalcharacteristic that is a timing characteristic, such as a duration(e.g., 50 μS) in which sufficient sensing signals develop at a senseamplifier (not shown) during the read operation. Read circuit 122,programming circuit 124, and erase circuit 126 can generatelayer-specific signals 118 having any number or type of signalcharacteristics that can be adapted and fine-tuned based on theparameters for individual memory layers, according to variousembodiments. As used herein, the term “parameter” can refer to a factorthat determines a range of variation in the operation of a memory cell.Examples of such parameters include structural attributes or features,such as the size or thickness of a semiconductor material, operationalsignals (e.g., input voltages, such as Vcc), and the like.

Characteristic adaption circuit 140 is configured to modify a signalcharacteristic to form a modified signal characteristic with which toaccess memory 112, and is configured further to adapt an access signalin accordance with the modified signal characteristic that is targetedfor a specific layer of memory, such as targeting layer 114 c instead oflayer 114 d. In some embodiments, characteristic adaption circuit 140includes a characteristic adjuster 142 that can be configured to adjustthe access signal to form an adjusted access signal for individuallayers in the multiple layers of memory. Note that an adjusted accesssignal for a specific layer of memory can be derived independently ofthe other access signals or other layers of memory. As such, an accesssignal for one layer of memory (e.g., layer 114 b) can have a signalcharacteristic at a first value, and another access signal for anotherlayer (e.g., layer 114 f) can have second value for the same signalcharacteristic. In at least some embodiments, characteristic adjuster142 is further configured to adjust an access signal based on one ormore parameters associated with individual layers 114 of memory to formmultiple adjusted access signals as layer-specific access signals 118.Therefore, if two or more layers 114 a to 114 f of memory are associatedwith different parameters (e.g., different structural and/or functionalattributes), then characteristic adjuster 142 can generate differentaccess signals based on, or as a function of, the different parameters.

In some embodiments, characteristic adjuster 142 includes a repositorystoring delta values 144 (or otherwise has access to a pool of deltavalues 144) that are used to adjust the access signals and signalcharacteristics, where each of the delta values 144 is derived inassociation with a parameter for a specific layer of memory. A deltavalue can indicate a value (e.g., a magnitude, a timing value, adescriptive value, such as identifying whether to implement memory cellsin a layer as a multi-level cell (MLC) that stores more than one-bit ofdata (e.g., two-bits as 00, 01, 10, or 11), or a single-level cell (SLC)that stores only one-bit of data (e.g., a single bit as 0 or 1), and thelike), whereby the delta value approximates and/or indicates the degreeto which a variation in the parameter affects operation of a memorycell, and, in some cases, the degree to which an access signal is to beadjusted to compensate for the effects of the parameter. In someembodiments, a delta value represents an incremental amount to be addedor subtracted to an existing value for a signal characteristic, or itcan by any value used to modify a value of the existing value for asignal characteristic. Or, a delta value can be an amount that replacesan existing value for a signal characteristic. In some instances, adelta value can be implemented as a layer-specific trim value composedof a number of bits derived from characterizing the effects of aparameter during testing, such as wafer-level testing, or during in-situcharacterization. As to the former, an external testing apparatus candetermine delta values and program those delta values into integratedcircuit 100.

In view of the foregoing, the structures and/or functionalities ofintegrated circuit 100 can customize signal characteristics for eachmemory layer 114 a to 114 f to compensate for layer-specific variationsof parameters, according to various embodiments. Characteristic adjuster142 can be configured to adjust the access signal to compensate fordifferent parameter values relating to a structure formed in each of themultiple layers of memory. An example of such a structure is a sub-layerof semiconductor material used to form memory cells in the multiplelayers of memory 112. A sub-layer in layers 114 a to 114 f of memory canbe associated with different parameter values. For example, a parameterthat can differ over layers 114 a to 114 f of memory is a thickness ofthe sub-layer that can vary due to process variations. For example, asub-layer composed of a dielectric material can have one thickness atlayer 114 f of memory, but another thickness at layer 114 a of memory.Unlike single layers of memory formed directly on FEOL substrate 135,each BEOL layer 114 a to 114 f is formed at different times during thefabrication of memory 112, and, as such, there may be differentvariations in process (e.g., different parameters may differ) from onelayer to the next. Although the layers 114 a to 114 f of memory 112 aredepicted as being separate layers for purposes of illustration, thelayers 114 a to 114 f are in contact with one another, are verticallystacked above one another, are electrically coupled with the circuitryin FEOL logic layer 130, and are in contact with the substrate 135(e.g., bottommost layer 114 f is fabricated first on an upper surface135 s of substrate 135). Characteristic adjuster 142, therefore,provides for enhanced controllability of signal characteristics tofine-tune access signals over memory architectures that use a singleaccess signal in a memory operation to access a memory. Enhancedcontrollability of access signals and signal characteristic, in turn,can give rise to improved memory device yield.

In some embodiments, a repository storing delta values 144 can bedisposed in the multiple layers of memory 112, such as repository 116 inBEOL layer 114 e of memory 112. As repository 116 can be located abovelogic layer 130, area that otherwise would be consumed by repository 116in logic layer 130 need not exist. Therefore, the storage of deltavalues 144 in memory 112 can conserve resources (e.g., silicon area on adie). In at least one embodiment, optional characterizer 146 can beimplemented on-chip (e.g., by circuitry in logic layer 130) to determinedelta values 144 (or a subset thereof) in-situ. For example,characterizer 146 can characterize the effects of a parameter onmultiple layers of memory 112, and can determine (e.g., characterizer146 can calculate or predict) a delta value 144 in-situ and withinintegrated circuit 100.

Characteristic adjuster 142 can be configured to determine an accessoperation in relation to an access to a specific memory layer. Examplesof such an access operation include a read operation, a programoperation, an erase operation, a block erase operation, a program verifyoperation, an erase verify operation, among other types of memoryoperations in which memory cells are accessed. Based on the type ofaccess operation being performed, characteristic adjuster 142 canidentify a signal characteristic, such as a programming voltage level,to be adjusted when accessing a memory layer, according to someembodiments. In some cases, characteristic adjuster 142 is configured tomodify the signal characteristic as specified by a delta value 144 toform a modified signal characteristic. Further, characteristic adjuster142 can adapt an access signal in accordance with a modified signalcharacteristic for a specific memory layer to comply or otherwiseoperate in a range of desired values. To illustrate, consider thatcharacteristic adjuster 142 determines that a programming operation hasbeen initiated to program memory cells in layer 114 c. Characteradjuster 142 then selects a delta value, such as 0.5 volts, targeted forlayer 114 c from a pool of delta values 144, the delta value beingderived from a parameter (or a variation thereof) associated with layer114 c. Characteristic adjuster 142 then modifies a signalcharacteristic, such a programming voltage of 1.75 volts, by addingdelta value of 0.5 volts. Thus, the modified signal characteristic is2.25 volts, which access signal generator 120 generates for transmissionto layer 114 c to comply with, for example, a specified programmingvoltage range between 2.15 volts and 2.30 volts.

FIG. 2 is a diagram depicting a specific implementation of acharacteristic adjuster in accordance with various embodiments. Diagram200 depicts a BEOL memory array 210 disposed over a FEOL logic layer250, which, in turn, is formed on substrate 280. Logic layer 250includes a number of semiconductor devices 252 and metal layers 251 andother electrically conductive structures such a vias, plugs, contacts,damascenes, or the like operative as an interlayer interconnectstructure 255 (shown in dashed outline), as well as a characteristicadaption circuit 260 and an access signal generator 270. According tovarious embodiments, portions of either characteristic adaption circuit260 or an access signal generator 270, or both, can be implemented inFEOL logic layer 250, in BEOL memory array 210, or both. For example,characteristic adaption circuit 260 in FEOL logic layer 250 can includea repository of delta values (not shown) disposed in BEOL array 210 andaccessible via path 262. In some embodiments, characteristic adaptioncircuit 260 and access signal generator 270, or other peripherycircuitry, can be formed in logic layer 250 on substrate 280 usingcomplementary metal-oxide-semiconductor (“CMOS”) fabrication processes,including relatively low voltage CMOS fabrications processes (e.g., tofabricate low voltage CMOS fabrication devices operable with gatevoltages of 1.5 volts or less). One example of a suitable CMOSfabrication technology is 45 nm technology.

In some embodiments, memory array 210 can be structured as a cross pointarray, with layers of memory (e.g., layers “0” to “3”) including memorycells 220 disposed in between X-lines (i.e., row lines) and Y-lines(i.e., bit lines), such as between X-line 214 a and Y-line 212 a (e.g.,layer “3”), between X-line 214 a and Y-line 212 b (e.g., layer “2”),between Y-line 212 b and X-line 214 b (e.g., layer “1”), or betweenX-line 214 b and Y-line 212 c (e.g., layer “0”). Memory cell 220 caninclude two terminals (i.e., is a two-terminal memory cell), eachterminal being coupled to an array line. Further, memory cell 220 caninclude a resistive state memory element (“ME”) 221 (e.g., atwo-terminal memory element). Note that while memory cell 220 can be atwo-terminal memory cell, the various embodiments can apply to memorycells having any number of terminals, and, thus, the various embodimentsare not limited to resistance-based or CMO-based memory elements orresistance-based memory elements and can be implemented with othermemory technologies. While the layers shown can be shown as beingparallel to an X-Y plane (i.e., parallel to substrate 280), the layersare not so limited and can be parallel to a Y-Z plane or an X-Z plane.

In some embodiments, memory cell 220 can include a resistive memoryelement 221, which includes a structure implementing an electrolyticinsulator (“EI”) as a sub-layer, and a structure based on one or morelayers of a conductive oxide material, such as a conductive metaloxide-based (“CMO-based”) material as another sub-layer. The conductivemetal oxide-based and the electrolytic insulator are in contact witheach other and are electrically in series with each other. In variousembodiments, the structure can include one or more layers of aconductive oxide material, such as one or more layers of a conductivemetal oxide-based (“CMO-based”) material, for example. In variousembodiments, structure can include but is not limited to a perovskitematerial selected from one or more the following: PrCaMnO_(X) (PCMO),LaNiO_(X) (LNO), SrRuO_(X) (SRO), LaSrCrO_(X) (LSCrO), LaCaMnO_(X)(LCMO), LaSrCaMnO_(X) (LSCMO), LaSrMnO_(X) (LSMO), LaSrCoO_(X) (LSCMO),and LaSrFeO_(X) (LSFeO), where x is nominally 3 for perovskites orstructure can be a conductive binary oxide structure comprised of abinary metal oxide having the form A_(X)O_(Y), where A represents ametal and O represents oxygen. The conductive binary oxide material maybe doped (e.g., with niobium—Nb, fluorine—F, and nitrogen—N) to obtainthe desired conductive properties for a CMO. In various embodiments,electrolytic insulator can include but is not limited to a material forimplementing a tunnel barrier layer, the material being selected fromone or more of the following: high-k dielectric materials, rare earthoxides, rare earth metal oxides, yttria-stabilized zirconium (YSZ),zirconia (ZrO_(X)), yttrium oxide (YO_(X)), erbium oxide (ErO_(X)),gadolinium oxide (GdO_(X)), lanthanum aluminum oxide (LaAlO_(X)), andhafnium oxide (HfO_(X)), and equivalent materials. Typically, theelectrolytic insulator comprises a thin-film layer having a thickness ofapproximately less than 50 Å (e.g., in a range from about 10 Å to about35 Å). In some embodiments, the sub-layers can include a sub-layerincluding metal oxide(s) to optionally implement an optional non-ohmicdevice (“NOD”), and can include sub-layers implemented as, for example,platinum (Pt) electrodes, titanium nitride (TiN) electrodes.

According to an embodiment, sub-layers of memory element 221 arerelatively thin layers and, in some cases, are sensitive to processvariations. In some examples, the sub-layers of memory element 221 canrange in thickness, for example, from 25 Angstrom to 250 Angstrom.During fabrication sub-layers of CMO-based material, electrolyticinsulator material (e.g., a tunnel barrier layer) and an optionalnon-ohmic device (NOD) material are formed at different times and duringdifferent processing cycles. As such, these sub-layers may experienceone set of process variations when fabricating layer “0,” but mayexperience another set of process variations when fabricating layer “3.”Thus, the thicknesses (and/or attributes) of the sub-layers can varyover the multiples layer of memory. Characteristic adaption circuit 260and access signal generator 270 cooperate to adjust access signals tocompensate to the difference process variations that may affect thesub-layers.

FIG. 3 depicts a cross-section view for an example of an integratedcircuit, according to one embodiment. The cross-section view shows anintegrated circuit 300 having multiple BEOL memory layers beingvertically disposed above or on a FEOL logic layer 302, which caninclude logic circuitry for reading data from memory cells as well asprogramming and erasing logical values in the memory elements. Logiclayer 302 and its logic circuitry can be formed upon a semiconductorsubstrate 301 (e.g., a Silicon—Si wafer or die) The logic circuitry, forexample, can include a portion of characteristic adjuster 342 (the otherportion optionally residing in layer 307), and an access signalgenerator 344 configured to compensate for variations in a parameterdifferently for different BEOL layers 304 to 308 by generating differentadjusted access signals via path 324 each targeting one of layers 304 to308. The portion of characteristic adjuster 342 in the logic layer 302includes a selector 340 that is configured to select a repository (or asubset of delta values) in one of the BEOL memory layers. Multiple BEOLmemory layers can include a first layer 304, a second layer 305, a thirdlayer 306, a fourth layer 307 and an “nth” layer 308 of third dimensionmemory. One or more layers 304 to 308 can include a portion ofcharacteristic adjuster 342. In this example, the portion ofcharacteristic adjuster 342 in the memory layers includes a repositoryfor storing subsets of delta values 338 a.

To illustrate the operation of integration circuit 300, consider that amemory cell is to be accessed during a memory operation, such as a readoperation. Selector 340 is configured to decode an address to determinethat memory cell (“mem”) 370 in memory layer 305 is going to beaccessed. Selector 340 can further be configured to select a delta valuein BEOL repository including subsets of delta values 338 a. Theretrieved delta value corresponds to a parameter in memory layer 305 asthat is where memory cell 370 resides. Subsequently, characteristicadjuster 342 receives a delta value from the repository, and isconfigured to adjust an access signal to form a modified access signal.Access signal generator 344 is configured to generate the modifiedaccess signal as an adjusted access signal and transmit the adjustedaccess signal to layer 305 via path 324 to memory cell 370.

FIG. 4 is a flow diagram 400 depicting an example of a process foradjusting access signals to access multiple layers of memory, accordingto some embodiments. At a stage 402, an address is detected that isassociated with an access to one of more memory cells. Based on theaddress, a layer of memory that is to be accessed is determined at astage 404. At a stage 406, a determination is made as to the type ofaccess operation that is to be performed to access the addressed memorycells. The access operation can be a read operation, a programmingoperation, an erase operation, or any other memory-related operation. Bydetermining the type of memory operation, an integrated circuit canreduce the pool of candidate delta values from which a delta value isselected. For example, during a write operation, delta values for anerase operation need not be available. Once the access operation isdetermined, then one or more signal characteristics can be identified.Optionally, flow 400 includes a stage 410 at which a determination ismade whether to characterize a parameter to calculate a layer-specificdelta value at a stage 412 or to fetch a layer-specific delta value froma repository at a stage 414. In some embodiments, stage 410 and stage412 are omitted so that flow 400 passes from stage 408 to stage 414directly. At a stage 416, flow 400 provides for the adjustment of signalcharacteristic to obtain a modified signal characteristic using thedelta value determined, for example, at a stage 414. Next, an adjustedaccess signal is generated at a stage 418, and is subsequently appliedto a memory cell at a stage 420. Flow 400 terminates at a stage 422.

FIG. 5 is a functional block diagram 500 depicting an example of acharacteristic adjuster configured to adjust access signals used toaccess multiple layers of memory, according to some embodiments. Diagram500 depicts a characteristic adaption circuit 501, an access signalgenerator 540 and one or more layers of memory 550. Characteristicadaption circuit 501 can include one or more repositories 510 (e.g.,BEOL repositories in one or more layers of BEOL memory 550) storingdelta values, a characterization circuit 520, and a characteristicadjuster 535. Characteristic adjuster 535 is shown to also include aselector 530 configured to select a delta value from one or morerepositories 510 responsive to an address 502.

One or more repositories 510 are shown to include examples of subsets ofdelta values representative of similar types of delta values fordifferent layers of memory. Subset 512 of delta values includesmagnitude and/or quantity-related delta values for different layers(e.g., layers 0 (“L0”) to layers 3 (“L3”)). Examples of delta values insubset 512 includes delta values representing amounts to modifyprogramming voltage signal levels, erase voltage signal levels, readvoltage signal levels, erase verify voltage signal levels, andprogramming verify voltage signal levels, among others, where theamounts are customized for specific layers of memory. Other examples ofdelta values in subset 512 include delta values representing quantities,such as a number of bits accessed per programming cycle. To illustrate,consider that memory cells in layer 552 conduct more current than memorycells in layer 554 due to variations in parameters between the twolayers. This can be due to, for example, memory cells in layer 552having thinner tunnel barrier sub-layers than memory cells in layer 554.The number of bits programmed at one time ought to be reduced todecrease the programming current used for programming memory cells 552.Otherwise, the drivers may not be able to deliver sufficient programmingcurrent. Therefore, a delta value representing a number of bits (e.g.,“8 bits,”) for layer 552 is less than a delta value representing anumber of bits (e.g., “64 bit”) for layer 554. Access signal generator540 then can generate different programming access signals to access 8bits and 64 bit when programming memory cells in layers 552 and 554,respectively.

Subset 514 of delta values includes timing-related delta values fordifferent layers (e.g., layers 0 (“L0”) to layers 3 (“L3”)). Examples ofdelta values in subset 514 includes delta values representing amounts toadjust a duration of a programming pulse width for programming accesssignals, amounts to vary read timing (e.g., related to latency), andother amounts relating to time-based or duration-based delta values.Subset 514 of delta values also can include delta values representing arate of change, such as the rate at which a programming pulse is to riseand fall. Subset 516 of delta values includes other delta values fordifferent layers (e.g., layers 0 (“L0”) to layers 3 (“L3”)), includingdescriptive-related data values. Examples of delta values in subset 516include delta values representing values that indicate descriptiveactions to be taken in relation to a specific layer. For example, adelta value in subset 514 can represent an indication to access memorycells in layer 552 as multi-level cells (“MLCs”), whereas another deltavalue can specify that memory cells in layer 554 is to be accessed assingle-level cells (“SLCs”). Further, delta values in subset 514 canrepresent constants or variables used in algorithms performed bycharacteristics adjuster 535 to systematically apply access signalsdifferently for various layers of memory.

FIG. 6 is a top plan view depicting a single wafer (denoted as 1170 and1170′) at two different stages of fabrication: FEOL processing on thewafer denoted as 1170 during the FEOL stage of processing where activecircuitry in logic layer 302 is fabricated on the substrate 301 (e.g.,silicon wafer); followed by BEOL processing on the same wafer denoted as1170′ during the BEOL stage of processing where one or more layers(e.g., 304-308) of non-volatile memory are formed. In an embodiment, oneor more layers (e.g., 304-308) may comprise non-flash re-writeablenon-volatile memory. Wafer 1170 includes a plurality of the base layerdie 301 (see substrate 301 in FIG. 3) formed individually on wafer 1170as part of the FEOL process. As part of the FEOL processing, the baselayer die 301 may be tested 1172 to determine their electricalcharacteristics, functionality, performance grading, etc. After all FEOLprocesses have been completed, the wafer 1170 is optionally transported1104 for subsequent BEOL processing (e.g., adding one or more layers ofmemory such as single layer 304 or multiple layers 305, . . . 308)directly on top of each base layer die 301. A base layer die 301 isdepicted in cross-sectional view along a dashed line FF-FF where thesubstrate the die 301 is fabricated on (e.g., a silicon Si wafer) andits associated active circuitry in logic layer 302 are positioned alongthe −Z axis. For example, the one or more layers of memory (e.g.,304-308) are grown directly on top of an upper surface 302 s of eachbase layer die 301 as part of the subsequent BEOL processing. Upperlayer 302 s can be an upper planar surface of the aforementionedinterlayer interconnect structure (see FIG. 2) operative as a foundationfor subsequent BEOL fabrication of the memory layers along the +Z axis.

During BEOL processing the wafer 1170 is denoted as wafer 1170′, whichis the same wafer subjected to additional processing to fabricate thememory layer(s) directly on top of the base layer die 301. Base layerdie 301 that failed testing may be identified either visually (e.g., bymarking) or electronically (e.g., in a file, database, email, etc.) andcommunicated to the BEOL fabricator and/or fabrication facility.Similarly, performance graded base layer die 301 (e.g., graded as tofrequency of operation) may be identified and communicated to the BEOLfabricator and/or fabrication facility. In some applications the FEOLand BEOL processing can be done by the same fabricator or performed atthe same fabrication facility. Accordingly, the transport 1104 may notbe necessary and the wafer 1170 can continue to be processed as thewafer 1170′. The BEOL process forms the aforementioned memory layer(s)directly on top of the base layer die 301 to form a finished die 300(see above reference to die 300 in regards to FIG. 3) that includes theFEOL circuitry portion 301 along the −Z axis and the BEOL memory portionalong the +Z axis. A cross-sectional view along a dashed line BB-BBdepicts a memory device die 300 with a single layer of memory 304 grown(e.g., fabricated) directly on top of base die 301 along the +Z axis,and alternatively, another memory device die 300 with three verticallystacked layers of memory 304, 305, and 306 grown (e.g., fabricated)directly on top of base die 301 along the +Z. Finished die 300 on wafer1170′ may be tested 1174 and good and/or bad die identified.Subsequently, the wafer 1170′ can be singulated 1178 to remove die 300(e.g., die 300 are precision cut or sawed from wafer 1170′) to formindividual memory device die 300. The singulated die 300 maysubsequently be packaged 1179 to form integrated circuit chip 1190 formounting to a PC board or the like, as a component in an electricalsystem (not shown). Die 300 need not be mounted in a package in order tobe regarded and an integrated circuit (IC). Here a package 1181 caninclude an interconnect structure 1187 (e.g., pins, solder balls, orsolder bumps) and the die 300 mounted in the package 1181 andelectrically coupled 1183 with the interconnect structure 1187 (e.g.,using wire bonding). The integrated circuits 1190 (IC 1190 hereinafter)may undergo additional testing 1185 to ensure functionality and yield.The die 300 or the IC 1190 can be used in any system requiringnon-volatile memory and can be used to emulate a variety of memory typesincluding but not limited to SRAM, DRAM, and FLASH. Unlike conventionalFLASH non-volatile memory, the die 300 and/or the IC's 1190 do notrequire an erase operation or a block erase operation prior to a writeoperation so the latency associated with conventional Flash memory eraseoperations is eliminated and the latency associated with FLASH OS and/orFLASH file system required for managing the erase operation iseliminated. Another application for the IC's 1190 is as a replacementfor conventional FLASH-based non-volatile memory in solid state drives(SSD's) or hard disc drives (HDD's).

In at least some of the embodiments of the invention, the structuresand/or functions of any of the above-described features and elements canbe implemented in software, hardware, firmware, circuitry, a computerreadable medium, or a combination thereof. Note that the structures andconstituent elements shown in the figures, as well as theirfunctionality, can be aggregated with one or more other structures orelements. Alternatively, the elements and their functionality can besubdivided into constituent sub-elements, if any.

The various embodiments of the invention can be implemented in numerousways, including as a system, a process, an apparatus, or a series ofprogram instructions on a computer readable medium such as a computerreadable storage medium or a computer network where the programinstructions are sent over optical or electronic communication links. Ingeneral, the steps of disclosed processes can be performed in anarbitrary order, unless otherwise provided in the claims.

The foregoing description, for purposes of explanation, uses specificnomenclature to provide a thorough understanding of the invention.However, it will be apparent to one skilled in the art that specificdetails are not required in order to practice the invention. In fact,this description should not be read to limit any feature or aspect ofthe present invention to any embodiment; rather features and aspects ofone embodiment can readily be interchanged with other embodiments.Notably, not every benefit described herein need be realized by eachembodiment of the present invention; rather any specific embodiment canprovide one or more of the advantages discussed above. In the claims,elements and/or operations do not imply any particular order ofoperation, unless explicitly stated in the claims. It is intended thatthe following claims and their equivalents define the scope of theinvention.

What is claimed is:
 1. An apparatus comprising: a logic layer formed ona substrate, the logic layer comprising a characterization circuit; amemory comprising one or more layers formed above the logic layer,wherein the characterization circuit is to determine a first parameterof a first layer of the one or more layers and to generate a first deltavalue based at least in part on the first parameter, the first deltavalue representing a degree to which an access signal applied to thefirst layer during an access operation is adjusted.
 2. The apparatus ofclaim 1, wherein the first parameter comprises at least one of astructural attribute or an operational attribute of the first layer. 3.The apparatus of claim 1, wherein the first delta value indicates adegree to which a variation in the first parameter affects operation ofa memory cell fabricated on the first layer accessed during the accessoperation.
 4. The apparatus of claim 1, wherein the characterizationcircuit is further to store the first delta value in a data storecomprising a plurality of delta values, each corresponding to adifferent layer of the one or more layers.
 5. The apparatus of claim 1,wherein the characterization circuit is further to determine a secondparameter of a second layer of the one or more layers and to generate asecond delta value based at least in part on the second parameter, thesecond delta value representing a degree to which the access signalapplied to the second layer during an access operation is adjusted. 6.The apparatus of claim 1, wherein the memory comprises a non-flashrewriteable non-volatile memory.
 7. The apparatus of claim 1, whereineach layer of the memory comprises a non-volatile cross-point memoryarray.
 8. The apparatus of claim 7, further comprising: an interlayerinterconnect structure formed on top of the logic layer, the interlayerinterconnect structure to electrically couple conductive array lines ofthe non-volatile cross-point memory array with the logic layer.
 9. Amethod comprising: determining, by a characterization circuit, a firstparameter of a first layer of one or more layers in a memory, the one ormore layers formed above a logic layer, the logic layer comprising thecharacterization circuit; and generating, by the characterizationcircuit, a first delta value based at least in part on the firstparameter, the first delta value representing a degree to which anaccess signal applied to the first layer during an access operation isadjusted.
 10. The method of claim 9, wherein determining the firstparameter comprises determining at least one of at least one of astructural attribute or an operational attribute of the first layer. 11.The method of claim 9, wherein the first delta value indicates a degreeto which a variation in the first parameter affects operation of amemory cell fabricated on the first layer accessed during the accessoperation.
 12. The method of claim 9, further comprising: storing, bythe characterization circuit, the first delta value in a data storecomprising a plurality of delta values, each corresponding to adifferent layer of the one or more layers.
 13. The method of claim 9,further comprising: determining, by the characterization circuit, asecond parameter of a second layer of the one or more layers; andgenerating, by the characterization circuit, a second delta value basedat least in part on the second parameter, the second delta valuerepresenting a degree to which the access signal applied to the secondlayer during an access operation is adjusted.
 14. A memory devicecomprising: a substrate; a characterization circuit formed in a logiclayer on the substrate; and a plurality of memory layers formed abovethe logic layer, wherein the characterization circuit is to determine afirst parameter of a first layer of the one or more layers and togenerate a first delta value based at least in part on the firstparameter, the first delta value representing a degree to which anaccess signal applied to the first layer during an access operation isadjusted.
 15. The memory device of claim 14, wherein the first parametercomprises at least one of a structural attribute or an operationalattribute of the first layer.
 16. The memory device of claim 14, whereinthe first delta value indicates a degree to which a variation in thefirst parameter affects operation of a memory cell fabricated on thefirst layer accessed during the access operation.
 17. The memory deviceof claim 14, wherein the characterization circuit is further to storethe first delta value in a data store comprising a plurality of deltavalues, each corresponding to a different layer of the one or morelayers.
 18. The memory device of claim 14, wherein the characterizationcircuit is further to determine a second parameter of a second layer ofthe one or more layers and to generate a second delta value based atleast in part on the second parameter, the second delta valuerepresenting a degree to which the access signal applied to the secondlayer during an access operation is adjusted.
 19. The memory device ofclaim 14, wherein the plurality of memory layers comprise non-flashrewriteable non-volatile memory layers.
 20. The memory device of claim14, wherein each layer of the plurality of memory layers comprises anon-volatile cross-point memory array.